Lihlahisoa tse ka sehloohong
PCB ea tšepe
FPC
FR4+E kenyelelitsoe
PCBA
Sebaka sa Kopo
Maemo a Kopo ea Lihlahisoa tsa Khampani
Ts'ebeliso e ipapisitse le NIO ES8
Kopo e ipapisitse le ZEEKR 001
Matrix headlight module ea ZEEKR 001 e sebelisa karolo e le 'ngoe ea koporo ea PCB e nang le thekenoloji ea thermal vias, e hlahisoang ke k'hamphani ea rona, e finyelloang ka ho cheka li-vias tse foufetseng tse nang le taolo e tebileng ebe ho phunya koporo ka lesoba ho etsa lera la potoloho le tlase. koporo substrate conductive, kahoo hlokomela mocheso conduction. Ts'ebetso ea eona ea ho senya mocheso e phahametse ea boto e tloaelehileng e nang le lehlakore le le leng, 'me ka nako e ts'oanang e rarolla mathata a ho senya mocheso oa li-LED le li-IC, ho ntlafatsa bophelo ba tšebeletso ea lebone la hlooho.
Kopo ho khanya ea ADB ea Aston Martin
Karolo e le 'ngoe ea mahlakore a mabeli ea aluminium e hlahisoang ke k'hamphani ea rona e sebelisoa ho khanya ea ADB ea Aston Martin. Ha ho bapisoa le lebone le tloaelehileng, lebone la pele la ADB le bohlale ho feta, kahoo PCB e na le likarolo tse ngata le lithapo tse rarahaneng. Karolo ea ts'ebetso ea substrate ena ke ho sebelisa marako a mabeli ho rarolla bothata ba ho senya mocheso oa likarolo ka nako e le 'ngoe. Khampani ea rona e sebelisa mohaho oa mocheso o nang le mocheso o nang le mocheso oa mocheso oa 8W / MK ka likarolo tse peli tsa insulating. Mocheso hlahisoang ke likarolo e fetisoa ka vias mogote ho mocheso-dissipating insulating lera 'me joale ho e ka tlaase aluminium substrate.
Kopo e bohareng ba projeke ea AITO M9
PCB e kentsoeng ka har'a enjine ea lebone e bohareng e sebelisoang ho AITO M9 e fanoa ke rona, ho kenyeletsoa le tlhahiso ea komporo ea substrate PCB le ts'ebetso ea SMT. Sehlahisoa sena se sebelisa substrate ea koporo e nang le theknoloji ea ho arohana ha thermoelectric, 'me mocheso oa mohloli oa leseli o fetisetsoa ka ho toba ho substrate. Ho phaella moo, re sebelisa vacuum reflow soldering bakeng sa SMT, e lumellang tekanyo ea solder void hore e laoloe ka hare ho 1%, ka tsela eo ho rarolla hantle ho fetisoa ha mocheso oa LED le ho eketsa bophelo ba tšebeletso ea mohloli oohle oa leseli.
Kopo ka mabone a matla a maholo
| Ntho ea tlhahiso | Thermoelectric karohano koporo substrate |
| Lintho tse bonahalang | Substrate ea Koporo |
| Lera la Potoloho | 1-4L |
| Qetella botenya | 1-4 limilimithara |
| Botenya ba koporo ea potoloho | 1-4OZ |
| Sethala/sebaka | 0.1/0.075mm |
| Matla | 100-5000W |
| Kopo | Stagelamp, sesebelisoa sa lifoto, mabone a masimong |
Nyeoe ea kopo ea Flex-Rigid(Metal).
Lisebelisoa tse ka sehloohong le melemo ea tšepe e thehiloeng ho Flex-Rigid PCB
→ E sebelisoa ho mabone a koloi, lebone la toche, pono ea mahlo…
→ Ntle le likhoele tsa likhoele le khokahano ea terminal, sebopeho se ka nolofatsoa mme molumo oa 'mele oa lebone o ka fokotsoa.
→ Khokahano lipakeng tsa PCB e feto-fetohang le substrate e hatelloa le ho chesoa, e matla ho feta khokahano ea terminal.
IGBT Normal Structure & IMS_Cu Sebopeho
Melemo ea IMS_Cu Sebopeho ho Feta Sephutheloana sa Ceramic sa DBC:
➢ IMS_Cu PCB e ka sebelisoa bakeng sa likhokahano tsa mehala tse kholo, e fokotsa haholo palo ea likhokahano tsa lithapo tsa bonding.
➢ E felisitse ts'ebetso ea tjheseletso ea DBC le copper-substrate, ho fokotsa litšenyehelo le ho kopanya.
➢ IMS substrate e loketse ho feta bakeng sa limojule tsa matla a holimo a holimo-limo a kopantsoeng
Mothapo o kentsoeng oa koporo ho FR4 PCB e tloaelehileng le substrate ea koporo e kentsoeng ka hare ho FR4 PCB
Melemo ea Copper Substrate e Kenyelitsoeng ka Hare Holim'a Methapo ea Koporo e Welded ka Bokaholimo:
➢ Ka ho sebelisa tekhenoloji ea koporo e kentsoeng, mokhoa oa ho tjheseletsa mohala oa koporo oa fokotseha, ho hlongoa ho bonolo, le ts'ebetso ea ntlafatsoa;
➢ Ho sebelisa theknoloji ea koporo e kentsoeng, pheliso ea mocheso ea MOS e rarolloa hamolemo;
➢ Ntlafatsa haholo matla a mangata a hajoale, a ka etsa matla a holimo ho etsa mohlala 1000A kapa ho feta.
Methapo ea koporo e cheselitsoeng holim'a aluminium substrate & block e kentsoeng ea koporo ka har'a substrate ea koporo e lehlakoreng le le leng.
Melemo ea Thibelo e Kenyellelitsoeng ea Koporo Ka Hare Ho Fetisisa Mehala ea Koporo e Welded ka Bokaholimo (Bakeng sa tšepe ea PCB):
➢ Ka ho sebelisa tekhenoloji ea koporo e kentsoeng, mokhoa oa ho tjheseletsa mohala oa koporo oa fokotseha, ho hlongoa ho bonolo, le ts'ebetso ea ntlafatsoa;
➢ Ho sebelisa theknoloji ea koporo e kentsoeng, pheliso ea mocheso ea MOS e rarolloa hamolemo;
➢ Ntlafatsa haholo matla a mangata a hajoale, a ka etsa matla a holimo ho etsa mohlala 1000A kapa ho feta.
Substrate ea ceramic e kentsoeng ka hare ho FR4
Melemo ea Embedded Ceramic substrate:
➢ E ka ba lehlakore le le leng, mahlakoreng a mabeli, le mekhahlelo e mengata, 'me koloi ea LED le li-chips li ka kopanngoa.
➢ Aluminium nitride ceramics li loketse li-semiconductors tse nang le matla a phahameng a ho hanyetsa le litlhoko tse phahameng tsa ho senya mocheso.
Iteanye le rona:
Eketsa: Mokatong oa 4, Moaho oa A, lehlakore la 2 Bophirimela la Xizheng, Sechaba sa Shajiao, Toropo ea Humeng Dongguan
Mohala: 0769-84581370
Email: cliff.jiang@dgkangna.com
http://www.dgkangna.com
