| Hlopha | dintho | Bokgoni bo tlwaelehileng | Bokhoni bo khethehileng |
| palo ea lera | PCB e sa fetoheng | 2-14 | 2-24 |
| Flex PCB | 1-10 | 1-12 | |
| boto | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
| Min.Botenya | |||
| Max.Botenya | 6mm | 8mm | |
| Max.Boholo | 485mm * 1000mm | 485mm * 1500mm | |
| Hole & Slot | Min.Hole | 0.15 limilimithara | 0.05 limilimithara |
| Min.Slot Hole | 0.6 limilimithara | 0.5 limilimithara | |
| Aspect ratio | 10:01 | 12:01 | |
| Tsepamisa maikutlo | Min.Bophara / Sebaka | 0.05 / 0.05mm | 0.025 / 0.025mm |
| Mamello | Fumana W / S | ± 0.03 limilimithara | ± 0.02mm |
| (W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
| Mokoti ho lesoba | ± 0.075mm | ± 0.05mm | |
| Hole Dimension | ± 0.075mm | ± 0.05mm | |
| Tšitiso | 0 ≤ Boleng ≤ 50Ω : ± 5Ω 50Ω ≤ Boleng : ± 10%Ω | ||
| Lintho tse bonahalang | Tlhaloso ea Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | |
| ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Basefilm Morekisi ea ka sehloohong | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Tlhaloso ea Coverlay | PI: 2mil 1mil 0.5mil | ||
| Mobala oa LPI | Botala / Bosehla / Bosoeu / Botsho / Boputsoa / Bofubelu | ||
| PI Stiffener | T: 25um ~ 250um | ||
| FR4 Stiffener | T: 100um ~ 2000um | ||
| SUS Stiffener | T: 100um ~ 400um | ||
| AL Stiffener | T: 100um ~ 1600um | ||
| Theipi | 3M / Tesa / Nitto | ||
| EMI e sireletsa | Filimi ea silevera / Copper / enke ea silevera | ||
| Qetello ea bokaholimo | OSP | 0.1 - 0.3um | |
| HASL | Sn: 5um - 40um | ||
| HASL(Leed free) | Sn: 5um - 40um | ||
| ENEPIG | Ke: 1.0 - 6.0um | ||
| Ba : 0.015-0.10um | |||
| Au 0.015 - 0.10um | |||
| Ho petla khauta e thata | Ke: 1.0 - 6.0um | ||
| Au: 0.02um - 1um | |||
| Khauta e phatsimang | Ke: 1.0 - 6.0um | ||
| Au 0.02um - 0.1um | |||
| ENIG | Ke: 1.0 - 6.0um | ||
| Au 0.015um - 0.10um | |||
| Silevera e kentsoeng | Ag: 0.1 - 0.3um | ||
| Ho roala tin | Sn: 5um - 35um | ||
| SMT | Mofuta | 0.3mm pitch Connectors | |
| 0.4mm molumo oa BGA / QFP / QFN | |||
| Karolo ea 0201 |