Copper Substrate PCB bakeng sa Lebone la Kantle
Letlapa le le leng, botenya ba boto: 1.6mm;
Botenya ba koporo bo felileng: 35um,
Qetella: ENIG
Aluminium Substrate PCB e nang le Berguist Material
Boto e 'meli ea lera, botenya ba boto: 2.0mm;
Botenya ba koporo bo felileng: 35um,
Qetella: ENIG
3.0 W/mk aluminium substrate PCB
Boto e le 'ngoe ea lera, botenya ba boto: 1.0mm;
Botenya ba koporo bo felileng: 35um,
Qetella: ENIGPA
398W/mk high thermal conductivity koporo e thehiloeng PCB e sebelisetsoang mabone a Koloi
Boto e 'meli ea lera, botenya ba boto: 2.0mm;
Botenya ba koporo bo felileng: 35um,
Qetella: ENIG
8W/mk high thermal conductivity aluminium substrate PCB
Boto e 'meli ea lera, botenya ba boto: 2.0mm;
Botenya ba koporo bo felileng: 35um,
Qetella: ENIG
karohano ea mocheso le motlakase ea koporo e thehiloeng ho PCB e sebelisoang bakeng sa mabone a sethala
Boto e 'meli ea lera, botenya ba boto: 2.0mm;
Botenya ba koporo bo felileng: 35um,
Qetella: ENIG
PCB ea koporo e phahameng ea conductivity e nang le mahlaseli a kotsi a UV
Boto e le 'ngoe ea lera, botenya ba boto: 3.0mm;
Botenya ba koporo bo felileng: 35um,
Qetella: ENIG