Morero | Litaba | Bokhoni |
1 | sehlopha sa boto | Aluminium Base, Copper Base, Ceramics base Copper, Combined Bade Board |
2 | thepa | Aluminium ea ka tlung.Koporo ea ka tlung, aluminium e tsoang kantle ho naha, koporo e tsoang kantle ho naha |
3 | phekolo ea holimo | HASL/ENIG/OSP/sikering |
4 | layer account | Boto e hatisitsoeng ka mahlakoreng a le mong/boto e hatisitsoeng ka mahlakoreng a mabeli |
5 | maxi.Boto ea Boholo | 1200mm*480m(n |
6 | min.Boto ea Boto | 5mm*5mm |
7 | bophara ba line/apsce | 0.1mnV0.1mm |
8 | sotha le ho sotha | <=0.5%(tfiickness:1 .Omm,Boto ea Boholo:300mm*300mm) |
9 | botenya ba boto | 0.5mm-5.0mm |
10 | botenya ba koporo ea foil | 35urrV70um/105um/140um/175unV210um/245um/280um/315um/35Qjm |
11 | mamello | CNC routing: ± 0.1 limilimithara; punch: 士 0.1 limilimithara |
12 | Ngoliso ea V-CUT | ± 0.1mm |
13 | Sekoti lebota botenya ba koporo | 20um-35um |
14 | Mm ngoliso ea boemo ba lesoba (bapisa le data ea CAD) | ± 3mil(10.076mm) |
15 | Min.ho phunya lesoba | 1.0mm(Botenya ba boto bebw1.0mmr1.0mm) |
16 | Min.punching square slot | (Botenya ba boto bo ka tlase ho 1 .Omm, 1.0mm* 1 .Omm) |
17 | Ngoliso ea potoloho e hatisitsoeng | ± 0.076mm |
18 | Min.drill lesoba bophara | 0.6 limilimithara |
19 | botenya ba kalafo ya bokahodimo | plating khauta: Ni 4um-6um>Au0.1um-0.5umENIG:Ni 5um-6um,Au:0.0254um-0.127umsilevera: Ag3um-8umHASL:40um-1 OOum |
20 | Mamello ea V-CUTdegree | (Degree) |
21 | V-CUT boto botenya | 0.6mm-4.0mm |
22 | Min.tlhamo bophara | 0.15 limilimithara |
23 | Min.Soldor mask ho bula | 0.35 limilimithara |