MCPCB ke khutsufatso ea Metal core PCBs, ho kenyelletsa PCB e thehiloeng ho aluminium, PCB e thehiloeng ka koporo le PCB e thehiloeng ka tšepe.
Aluminium based board ke mofuta o atileng haholo.Thepa ea motheo e na le motheo oa aluminium, FR4 e tloaelehileng le koporo.E na le lera le koahetsoeng ka mocheso le futhumatsang mocheso ka mokhoa o sebetsang hantle haholo ha o ntse o pholile.Hajoale, Aluminium Based PCB e nkuoa e le tharollo ea matla a phahameng.Aluminium e thehiloeng boto e ka nka sebaka sa boto ea ceramic e tsitsitseng, 'me aluminium e fana ka matla le ho tšoarella ho sehlahisoa seo metheo ea ceramic e ke keng ea e khona.
Copper substrate ke e 'ngoe ea litšepe tse theko e boima ka ho fetisisa,' me conductivity ea eona ea mocheso e molemo ka makhetlo a mangata ho feta ea aluminium substrates le tšepe ea tšepe.E loketse ho felloa ke mocheso ka mokhoa o phahameng ka ho fetisisa oa li-circuits tse phahameng tsa maqhubu, likarolo tse libakeng tse nang le phapang e kholo ea mocheso o phahameng le o tlaase le lisebelisoa tsa puisano tse nepahetseng.
Thermal insulation layer ke e 'ngoe ea likarolo tsa mantlha tsa substrate ea koporo, kahoo botenya ba foil ea koporo ke boholo ba 35 m-280 m, e ka fihlelang matla a matla a ho jara hona joale.Ha ho bapisoa le substrate ea aluminium, substrate ea koporo e ka finyella phello e ntle ea ho senya mocheso, e le ho netefatsa botsitso ba sehlahisoa.
Sebopeho sa Aluminium PCB
Potoloho Koporo Lera
Lera la koporo la potoloho le ntlafatsoa le ho hlophisoa ho theha potoloho e hatisitsoeng, substrate ea aluminium e ka jara motlakase o phahameng ho feta FR-4 e teteaneng le bophara bo tšoanang.
Insulating Layer
The insulating layer ke thekenoloji ea mantlha ea substrate ea aluminium, e bapalang haholo mesebetsi ea ho kenya letsoho le ho tsamaisa mocheso.The aluminium substrate insulating layer ke mokoallo o moholo ka ho fetisisa oa mocheso mohahong oa mojule oa matla.Ho ntlafala ha mocheso oa mocheso oa lera la insulating, ho atleha haholoanyane ho jala mocheso o hlahisoang nakong ea ts'ebetso ea mochine, le ho theola mocheso oa mochine,
Metal substrate
Ke mofuta ofe oa tšepe oo re tla o khetha e le substrate ea tšepe e sireletsang?
Re hloka ho nahana ka coefficient ea ho atolosa mocheso, conductivity ea mocheso, matla, boima, boima, boemo ba holim'a metsi le litšenyehelo tsa substrate ea tšepe.
Ka tloaelo, aluminium e theko e tlaase ha e bapisoa le koporo.Lintho tse fumanehang tsa aluminium ke 6061, 5052, 1060 joalo-joalo.Haeba ho na le litlhoko tse phahameng bakeng sa conductivity ea mocheso, thepa ea mechine, thepa ea motlakase le lisebelisoa tse ling tse khethehileng, lipoleiti tsa koporo, lipoleiti tsa tšepe tse sa hloekang, lipoleiti tsa tšepe le lipoleiti tsa tšepe tsa silicon li ka boela tsa sebelisoa.
Kopo eaMCPCB
1. Molumo : Kenyelletso, sebuela-hōle, seamplifier se leka-lekaneng, seholisa molumo, seholisa matla.
2. Phepelo ea Matla: Ho fetola molaoli, converter ea DC / AC, molaoli oa SW, joalo-joalo.
3. Koloi: Molaoli oa elektronike, ho khantša, molaoli oa phepelo ea matla, joalo-joalo.
4. Khomphuta: Boto ea CPU, floppy disk drive, lisebelisoa tsa motlakase, joalo-joalo.
5. Li-Modules tsa Matla: Inverter, li-relays tse tiileng, marokho a lokisang.
6. Mabone le mabone: mabone a bolokang matla, mefuta e fapaneng ea mebala e mengata e bolokang matla a LED, mabone a kantle, mabone a sethala, mabone a seliba.
Mofuta oa tšepe: Aluminium base
Nomoro ea lihlopha:1
Bokaholimo:Keta HASL mahala
Botenya ba poleiti:1.5 limilimithara
Botenya ba koporo:35um
Thermal Conductivity:8W/mk
Ho hanyetsa mocheso:0.015℃/W
Mofuta oa tšepe: Aluminiummotheo
Nomoro ea lihlopha:2
Bokaholimo:OSP
Botenya ba poleiti:1.5 limilimithara
Botenya ba koporo: 35um
Mofuta oa ts'ebetso:Thermoelectric karohano koporo substrate
Thermal Conductivity:398W/mk
Ho hanyetsa mocheso:0.015℃/W
Mohopolo oa moralo:Tataiso ea tšepe e otlolohileng, sebaka sa ho kopana sa koporo se seholo, 'me lithapo li nyane.
Tsepamisa maikutlo ho faneng ka tharollo ea mong pu bakeng sa lilemo tse 5.