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Copper Substrate PCB bakeng sa Lebone la Kantle
Letlapa le le leng, botenya ba boto:2.0mm;
Botenya ba koporo bo felileng: 35um,
Qetella: ENIG
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5.0W/MK High Thermal Conductivity MCPCB Bakeng sa leseli la naha
Mofuta oa tšepe: Aluminium base
Palo ea mekhahlelo: 1
Bokaholimo:ENIG
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8.0W/mk high thermal conductivity MCPCB bakeng sa toche ea Motlakase
Mofuta oa tšepe: Aluminium base
Palo ea mekhahlelo: 1
Bokaholimo: Keta HASL ea mahala
Botenya ba poleiti: 1.5mm
Botenya ba koporo: 35um
Thermal conductivity: 8W/mk
Ho hanyetsa mocheso: 0.015 ℃/W
