| Lintho | Bokgoni |
| sehlopha sa boto | Aluminium Base, Koporo Base, Iron Base, Ceramics base Copper-clad, Combined Bade Board |
| thepa | Tsa lapeng Aluminium, koporo ea ka tlung, aluminium e kentsoeng ka letsoho, lmported koporo |
| phekolo ea holimo | HASL/ENIG/OSP/silvering |
| layer account | Boto e hatisitsoeng ka mahlakoreng a le mong/boto e hatisitsoeng ka mahlakoreng a mabeli |
| maxi.board Size | 1200mm * 480mm |
| min.board Size | 5mm*5mm |
| qaqisa bophara/apsce | 0.1mm/0.1mm |
| sotha le ho sotha | <=0.5%(botenya:1.6mm,Boto Boholo: 300mm * 300mm) |
| botenya ba boto | 0.5mm-5.0mm |
| koporo leoatla botenya | 35um/70um/105um/140um/175um/210um /245um/280um/315um/350um |
| V-CUT tekanyo ea mamello | CNC routing: ± 0.1mm; punch: ± 0.1mm |
| Ngoliso ea V-CUT | ±0.1mm |
| Sekoti lebota botenya ba koporo | 20um-35um |
| Min ngoliso ea boemo ba lesoba (bapisa le data ea CAD) | ±3mil(±0.076mm) |
| Min.ho phunya lesoba | 1.0 limilimithara ka tlase, 1.0mm (Boto botenya ka tlase ho 1.0mm, 1.0mm) |
| Min.ho otla sekoere sekotjana | 1.0mm ka tlase, 1.0mm * 1.0mm (Botenya ba boto ka tlase ho 1.0mm, 1.0mm * 1.0mm) |
| Ngoliso ea potoloho e hatisitsoeng | ± 0.076 limilimithara |
| Min.drill lesoba bophara | 0.6 limilimithara |
botenya ba phekolo ea bokaholimo | ho khabisa khauta: Ni 4um-6um, Au0.1um-0.5um ENIG:Ni 5um-6um,Au:0.0254um-0.127um silevera: Ag3um-8um HASL: 40um-100um |
| Mamello ea V-CUTdegree | ±5(degree) |
| Boto ea V-CUT botenya | 0.6mm-4.0mm |
| Min.Lefend wide | 0.15 limilimithara |
| Min.Solder mask ho bula | 0.35 limilimithara |