Moetsi oa Tlholisano ea PCB

Ceramic substrate e bua ka foil ea koporo ka mocheso o phahameng o kopantsoeng ka ho toba le aluminium oxide (Al2O3) kapa aluminium nitride (AlN) ceramic substrate surface (e le 'ngoe kapa habeli) poleiti e khethehileng ea tshebetso.Karolo e ka tlase e tšesaane haholo e na le ts'ebetso e ntle haholo ea ho kenya motlakase, ts'ebetso e phahameng ea mocheso, thepa e ntle haholo ea brazing le matla a holimo a ho khomarela, 'me e khona ho kenya mefuta eohle ea litšoantšo joalo ka boto ea PCB, e nang le matla a maholo a ho jara hajoale.Ka hona, substrate ea ceramic e fetohile thepa ea mantlha ea theknoloji ea sebopeho sa potoloho ea elektroniki le theknoloji ea khokahano.

Melemo ea boto e thehiloeng ho ceramic:

Khatello e matla ea mechine, sebopeho se tsitsitseng;Matla a phahameng, conductivity e phahameng ea mocheso, insulation e phahameng;Ho khomarela ka matla, anti-corrosion.

◆ Ts'ebetso e ntle ea potoloho ea mocheso, linako tsa potoloho ho fihlela makhetlo a 50,000, ho tšepahala ho phahameng.

◆ Sebopeho sa litšoantšo tse fapa-fapaneng li ka etsoa e le PCB (kapa IMS substrate);Ha ho tšilafalo, ha ho tšilafalo.

◆ Mocheso oa tšebeletso ke -55 ℃ ~ 850 ℃;Coefficient ea ho atolosa mocheso e haufi le silicon, e nolofatsang mokhoa oa ho hlahisa mochine oa matla.

Tšebeliso ea boto e entsoeng ka ceramic:

Ceramic substrates (alumina, aluminium nitride, silicon nitride, zirconia le zirconia toughening alumina e leng ZTA) ka lebaka la thepa ea eona e ntle ea mocheso, mochine, lik'hemik'hale le dielectric, e sebelisoa haholo ka har'a semiconductor chip packaging, li-sensor, lisebelisoa tsa elektroniki tsa puisano, mehala ea cellular le. Terminal e 'ngoe e bohlale, lisebelisoa le limithara, matla a macha, mohloli o mocha oa leseli, terene ea lebelo le phahameng ea likoloi, matla a moea, liroboto, sesole sa sefofane le tšireletso le masimo a mang a theknoloji e phahameng.Ho ea ka lipalo-palo, selemo se seng le se seng tse fapa-fapaneng ceramic substrate boleng fihla mashome a libilione tsa 'maraka, haholo-holo lilemong tsa morao tjena, ka tsoelo-pele e potlakileng ea Chaena likoloing tse ncha tsa matla, terene e lebelo le liteishene tsa motheo tsa 5 g, tlhokahalo ea substrate ea ceramic e kholo, feela ka koloing. sebakeng seo, palo ea tlhokahalo selemo le selemo e fihla ho limilione tse 5 tsa PCS;Alumina ceramic substrate ha e sebelisoe haholo indastering ea motlakase le ea elektronike, empa hape le ho sensor ea khatello le tšimo ea mocheso oa LED.

E sebelisoa hangata libakeng tse 5 tse latelang:

1.IGBT module bakeng sa terene e lebelo le phahameng, likoloi tse ncha tsa matla, ho hlahisa matla a moea, liroboto le liteishene tsa motheo tsa 5G;

2.Smart phone backplane le ho lemoha menoana;

3.Moloko o mocha lisele tse matla tsa mafura;

4.New flat plate pressure sensor sensor le oksijene sensor;

Phallo ea mocheso ea 5.LD/LED, tsamaiso ea laser, potoloho e kopantsoeng ea lebasetere;