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Copper Substrate PCB bakeng sa Lebone la Kantle
Letlapa le le leng, botenya ba boto:2.0mm;
Botenya ba koporo bo felileng: 35um,
Qetella: ENIG
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5.0W/MK High Thermal Conductivity MCPCB Bakeng sa leseli la naha
Mofuta oa tšepe: Aluminium base
Palo ea mekhahlelo: 1
Bokaholimo:ENIG
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8.0W/mk high thermal conductivity MCPCB bakeng sa toche ea Motlakase
Mofuta oa tšepe: Aluminium base
Palo ea mekhahlelo: 1
Bokaholimo: Keta HASL ea mahala
Botenya ba poleiti: 1.5mm
Botenya ba koporo: 35um
Thermal Conductivity: 8W/mk
Ho hanyetsa mocheso: 0.015 ℃/W
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Thin Polyimide e kobehang FPC e nang le FR4 stiffener
Mofuta oa lintho tse bonahalang: polyimide
Palo ea lera: 2
Botebo bo fokolang ba sebaka: 4 mil
Boholo ba lesoba: 0.20mm
E felile boto botenya: 0.30mm
Botenya ba koporo bo felileng: 35um
Qetella: ENIG
'Mala oa mask oa solder: khubelu
Nako ea ho tsamaisa: matsatsi a 10
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6 layer impedance control board e thata-flex e nang le stiffener
Mofuta oa lintho tse bonahalang: FR-4, polyimide
Botebo bo fokolang ba sebaka: 4 mil
Boholo ba lesoba: 0.15mm
E felile botenya ba boto: 1.6mm
Botenya ba FPC: 0.25mm
Botenya ba koporo bo felileng: 35um
Qetella: ENIG
'Mala oa mask oa solder: khubelu
Nako ea ho tsamaisa: matsatsi a 20
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Resin plugging lesoba Microvia Immersion silevera HDI ka ho phunya laser
Mofuta oa lintho tse bonahalang: FR4
Palo ea lera: 4
Botebo bo fokolang ba sebaka: 4 mil
Boholo ba lesoba: 0.10mm
A qeta boto botenya: 1.60mm
Botenya ba koporo bo felileng: 35um
Qetella: ENIG
'Mala oa mask oa solder: o moputsoa
Nako ea ho tsamaisa: matsatsi a 15
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3 oz solder mask plugging ENEPIG boto e boima ea koporo
Li-PCB tsa Heavy Copper li sebelisoa haholo tsamaisong ea Power Electronics le Power Supply moo ho nang le tlhokahalo e phahameng ea hona joale kapa monyetla oa ho thunya ka potlako ha hona joale. Boima ba koporo bo ntseng bo eketseha bo ka fetola boto e fokolang ea PCB hore e be sethaleng se tiileng, se ka tšeptjoang le se tšoarellang nako e telele 'me se hane tlhokahalo ea lisebelisoa tse ngata tse theko e boima le tse ngata tse kang Heat sinks, fans, joalo-joalo.
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Multilayer High Tg Board e nang le khauta e qoelisoang ea modem
Mofuta oa lintho tse bonahalang: FR4 Tg170
Palo ea lera: 4
Bophara ba metsotsoana / sebaka: 6 mil
Boholo ba lesoba: 0.30mm
E felile botenya ba boto: 2.0mm
Botenya ba koporo bo felileng: 35um
Qetella: ENIG
'Mala oa mask oa solder: tala"
Nako ea ho tsamaisa: matsatsi a 12
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ho qoelisoa ka lehlakore le le leng la khauta Ceramic based Board
Mofuta oa lintho tse bonahalang: Setsi sa ceramic
Palo ea lera: 1
Bophara ba metsotsoana / sebaka: 6 mil
Boholo ba lesoba: 1.6mm
A qeta boto botenya: 1.00mm
Botenya ba koporo bo felileng: 35um
Qetella: ENIG
'Mala oa mask oa solder: o moputsoa
Nako ea ho tsamaisa: matsatsi a 13
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Seboka se tlaase sa bongaka sa PCB SMT
SMT ke khutsufatso ea Surface Mounted Technology, theknoloji e tsebahalang haholo le ts'ebetso indastering ea kopano ea elektroniki. Electronic circuit Surface Mount Technology (SMT) e bitsoa Surface Mount kapa Surface Mount Technology. Ke mofuta oa theknoloji ea kopano ea potoloho e kenyang likarolo tsa kopano e se nang lead kapa e khuts'oane (SMC/SMD ka Sechaena) holim'a Printed Circuit Board (PCB) kapa sebaka se seng sa substrate, ebe e tjheseletsa le ho bokana ka ho tjheseletsa kapa kolobisa welding.
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chencha ka potlako mohlala oa khauta oa PCB o nang le lesoba la sink ea Counter
Mofuta oa lintho tse bonahalang: FR4
Palo ea lera: 4
Bophara ba metsotsoana / sebaka: 6 mil
Boholo ba lesoba: 0.30mm
A qeta boto botenya: 1.20mm
Botenya ba koporo bo felileng: 35um
Qetella: ENIG
'Mala oa mask oa solder: tala"
Nako ea ho tsamaisa: matsatsi a 3-4
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1.6mm e potlakileng ea mohlala oa FR4 PCB
Mofuta oa lintho tse bonahalang: FR-4
Palo ea lera: 2
Bophara ba metsotsoana / sebaka: 6 mil
Boholo ba lesoba: 0.40mm
E felile botenya ba boto: 1.2mm
Botenya ba koporo bo felileng: 35um
Qetella: etella HASL ea mahala
'Mala oa mask oa solder: o motala
Nako ea ho tsamaisa: matsatsi a 8